Especificações Técnicas

FEATURES: 1. HEATSINK FOR CPU USE 2. HELPS THE HEAT DISSIPATION FROM A CPU TO A HEATSINK 3. HIGH CONDUCTIVITY, LOW BLEED, STABLE AT HIGH TEMPERATURES   SPECIFICATIONS: 1. PRIMARY USE: THERMAL COUPLING OF ELECTRONIC DEVICES TO HEATSINKS  2. THERMAL CONDUCTIVITY: >1.22W/M.K 3. DIMENSIONS: (3.5 X 3)CM / (1.38 X 1.18)" (H X DIA) 4. WEIGHT: 26G / 0.92OZ   PACKAGE INCLUDES: 1 X THERMAL GREASE FOR CPU HC-151 PASTA TÉRMICA DE SILICONE CINZA 30G 1.22W/M.K TAGS DE HC-151: 1.22W/M.K, HC-151, 81007819, PASTA TERMICA, OEM

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