Especificações Técnicas

 FEATURES: SYRINGE DESIGN FOR EASY OPERATION.  HELPS DISPERSE THE HEAT FROM CPU TO HEATSINK EFFECTIVELY. SUITABLE FOR CPU HEATSINK OR CHIP. HIGH TEMPERATURE RESISTANCE. NON-TOXIC, TASTELESS, NON-CORROSIVE. PRIMARY USE: THERMAL COUPLING OF ELECTRICAL / ELECTRONIC DEVICES TO HEAT SINKS. SPECIAL PROPERTIES: HIGH CONDUCTIVITY; LOW BLEED; STABLE AT HIGH TEMPERATURES. SPECIFICATION: COLOR: GREY PASTE WEIGHT: 30G / 1.1OZ THERMAL CONDUCTIVITY: >1.829W/M-K THERMAL RESISTANCE:

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