Especificações Técnicas

• CPU SOCKET: 2011 (SQUARE TYPE, 80 X 80MM MOUNTING PITCH) • CPU SUPPORT: INTEL® SANDY BRIDGE EP/EX PROCESSORS • SOLUTION: 1U SERVER • OVERALL: DIMENSION 90.0 X 90.0 X 27.0  MM • WEIGHT: 435G • MATERIAL: VAPOR CHAMBER BASE WITH COPPER STACKED FIN R15 HEATSINK DYNATRON LGA 2011 1U MAIORES DETALHES DE R15 NO SITE DO FABRICANTE: HTTP://WWW.DYNATRON-CORP.COM/EN/PRODUCT_DETAIL_1.ASPX?CV=&ID=244&IN=0 TAGS DE R15: R18, R12, COOL-R15, K129, COOLER LGA 2011, COOLER LGA2011, HEATSINK DYNATRON R15, HEATSINK LGA 2011, HEATSINK LGA2011, HEATSINK SOCKET LGA 2011, HEATSINK SOCKET LGA2011, COOLER DYNATRON R15, DISSIPADOR LGA2011, DISSIPADOR LGA 2011, HEATSINK 1U, 10B31

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