Especificações Técnicas

CPU SOCKET 1155/1156   CPU SUPPORT: LGA 1155: INTEL® 2ND GENERATION CORE™ I7-2600, I5-2500 SERIES & SANDY BRIDGE XEON® PROCESSORS 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280   LGA1156: INTEL® CORE™ I3 I3-530 & I3-540, CORE™ I5 I5-650, I5-650,  I5-660, I5-661 I5-670 & I5-750; XEON® PROCESSOR 3400 SERIES; CORE™ I7 PROCESSORS, I7-870 & I7-860   SOLUTION 1U SERVER OVERALL DIMENSION: 90.0 X 90.0 X 26.5 MM WEIGHT: 490G ± 5G MATERIAL: COPPER HEATSINK K129 DYNATRON HEATSINK 1U COBRE LGA1155/56 MAIORES DETALHES DE K129 NO SITE DO FABRICANTE: HTTP://WWW.DYNATRON-CORP.COM/EN/PRODUCT_DETAIL_1.ASPX?CV=&ID=190&IN=0# TAGS DE K129: K129, DYNATRON K2, LGA1155, LGA-1155, LGA 1155, LGA1156, LGA-1156, LGA 1156, COOLER 1U, HEATSINJ 1U, FAN 1U, DISSIPADOR 1U, DESSIPADOR 1U, COPPER HEATSINK 1U SERVER CPU COOLER, COOL-K129

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