Especificações Técnicas

• CPU SOCKET: 2011 (NARROW TYPE, 56 X 94MM MOUNTING PITCH) • CPU SUPPORT: INTEL SANDY BRIDGE ROMLEY-EP/EX NARROW ILM PROCESSORS UP TO TDP 95 WATTS • SOLUTION: 1U SERVER • DIMENSÕES: 106X70X25.5 MM • MATERIAL: COBRE R12 HEATSINK DYNATRON 1U COBRE LGA 2011 MAIORES DETALHES DE R12 NO SITE DO FABRICANTE: HTTP://WWW.DYNATRON-CORP.COM/EN/PRODUCT_DETAIL_1.ASPX?CV=277&ID=237&IN=0 TAGS DE R12: R12, COOL-R12, COOLR12, HEATSINK DYNATRON R12, HEATSINK LGA 2011, HEATSINK LGA2011, HEATSINK SOCKET LGA 2011, HEATSINK SOCKET LGA2011, COOLER DYNATRON R12, DISSIPADOR LGA2011, DISSIPADOR LGA 2011, HEATSINK 1U, COOLER 1U, R16, R15, R18, COOLER PASSIVO 1U

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